Thermal Desktop을 활용한 전장박스 해석 편2

사례2 : High Fidelity Date Acquisition System (HiDAQ)

– Aluminum chassis

– 7 main circuit board, 5 sub boards

– Copper heat spreaders

– 15V Power Supply

– RFI filter

– Solid State Drives (SSDs)

– Remaining space filled with epoxy

– 27,500 nodes, 75,000 solid elements

– Conduction only

– epoxy와 component 간에 contact resistance 반영

Alternative Material Simulations

Spreader material

– Copper

– Aluminum

– No spreaders (epoxy only)